LAYERED IMAGING FOR SUBSURFACE FEATURES OF INTEGRATED CIRCUITS BY PHOTOACOUSTIC MICROSCOPY

Layered imaging of subsurface features of integrated circuits (IC) by photoac-oustic microscopy (PAM) is one of the important purposes of the investigations of PAM.In this paper,in according to the theory of one-dimensional thermoelastic model and the conditions of our PAM system (specially for the piezoelectric receiving system of the photoacoustic effects),we calculate and analyze the possibility of the layered imaging for the subsurface features of IC by PAM.On the other hand,we also show some pictures of the layered imaging of some IC obtained experimentally.It can be demonstrated that PAM as a powerful technique for monitoring and detecting the productions of IC will have important application prospect.